EPIKOTE™ MGS BPR 135 Adhesive

Bonding paste EPIKOTE™ MGSBPR135G3 is a solvent free epoxy based bonding paste with a wide range of applications. It is suitable for bonding laminates and wood and appropriately metallic and mineral components.
Bonding Paste Curing Agents
The available bonding paste curing agents show a wide range of processing times (pot life) which allows the selection of a curing agent which fits the processing conditions of interest:
EPIKURE™ Curing Agent MGSBPH1340G very fast
EPIKURE™ Curing Agent MGSBPH1355G fast
EPIKURE™ Curing Agent MGSBPH137GF slow (but fast TG development)
Paste Application – Sagging / Vertical Gaps
The bonding paste system is particularly suitable for vertical surfaces and wide gaps and is designed not to sag at typical application and cure temperatures. The bonding paste does not bleed out of vertical gaps even if the parts are immediately cured.

Bond line thickness control is important for any structural adhesive joint application to obtain consistent and optimal adhesive joint properties. For larger parts, such as found in boat and wind turbine blade production, bond line thicknesses of 1-10 mm are generally targeted. Due to the glass fiber in the bonding paste system, higher neat mechanical properties and low exothermic temperatures have been observed. In applications where bond line thicknesses may be greater than 10 mm or aggressive cure cycles are used, the effects of higher exothermic temperatures and lower adhesive joint properties should be evaluated.